Microelectronics & Packaging

The Laboratory has assembled a highly capable team of electronics and packaging engineers who have the ability to design, package, and deliver miniaturized, low power, and highly ruggedized electronics. Our designs have been utilized in the oceans, space, and environments in between. Our capabilities are derived from our team approach to the design process. The electronics and packaging engineers work together to ensure that our products meet all of our customers’ needs.


Draper’s electronics engineers cover the spectrum from base band analog to ten gigahertz. With an emphasis on new technology development and evaluations leading to proof-of-concept demonstrations, our projects cover all phases of development, including electrical system design, detailed design, system testing, and operational demonstration.

Our designs include inertial instrument control electronics, acoustic/seismic sensors and signal processing, motor controls, power conversion, Global Positioning System (GPS) receivers, radios, and processors. Draper has the proven ability to design for and mitigate both space and strategic radiation environments and to evaluate those designs analytically. We have designed and packaged electronics for strategic guidance systems to withstand the harshest radiation conditions.

By integrating many disciplines into a single effort, we have completed and fielded numerous designs that incorporate digital, RF, analog, and power conversion into a single miniaturized package, such as a battery-operated smart intrusion detection sensor system that incorporates a DSP for signal processing and an RF transmitter, all in a ruggedized low power package. We have extensive experience creating mixed-signal application-specific integrated circuits (ASICs), contributing to the high performance and small size of many of Draper’s microelectromechanical systems (MEMS) instruments.

The Laboratory currently is pursuing research and development in the areas of ultra-low power ASICs and radio frequency integrated circuits. We are exploring novel methods of creating large-scale ad hoc networks that provide high quality of service and security while minimizing power consumption by individual nodes and the network as a whole. We also are developing micron-gap thermophotovoltaics, a technology to convert heat directly to electricity.

Draper is a leader in miniaturizing highly complex electronic systems required to perform in a wide variety of severe environments. We utilize and continue to develop the highest density multichip module (MCM) circuit packaging technologies (including MCM-Laminate technology, MCM-Co-fire ceramic technology, and chips-first MCM-Ultra Thin Deposit technology). We develop innovative, low cost designs in the smallest possible space for autonomous, tactical, covert, strategic, space, and medical applications.

Draper’s expertise in packaging inertial MEMS, particularly for high-g environments, is unparalleled. This capability has been utilized in all of Draper’s munitions guidance programs, which have set the standard for a small, high-g GPS-aided inertial navigation system. We also have developed an inertial measurement unit on a chip by combining MEMS and ASIC packaging.

Draper technicians possess expertise in precision mechanical as well as microelectronics assembly. Draper delivers fully qualified hardware, works to stringent military and space requirements, and is ISO 9001:2000 certified.

• Rapid Prototyping Center, including stereolithography
• Application-specific integrated circuit (ASIC) design/simulation tools
• Microelectronics (Hybrid and Multichip Module) Assembly Laboratory
• Semi-automatic Surface Mount Technology Assembly Laboratory
• Precision Electromechanical Assembly Laboratory
• Environmental Test Facility
• Computer-aided design facility

Applications

• Few-of-a-kind operational prototypes
• Analog, digital, and mixed-signal systems
• Embedded processors
• Field-portable systems
• High reliability, space-qualified systems

Technologies / Capabilities

• RF systems/circuits
• Fault-tolerant processors
• Mixed-signal ASICs
• Multichip Module process development/fabrication
• Radiation hard electronics
• Low-rate production
• Miniaturization
• High-g environments