Miniature Low-Power Systems
The design, development, prototyping, and in some cases, low-rate production of miniature, low-power, electromechanical systems is a rapidly growing business for Draper. This capability includes system conceptualization and design methods for addressing demanding and unique customer requirements and draws on miniature electronics packaging technology including.
- MCM-D (multichip module)
- i-UHD packaging (integrated ultrahigh-density)
- HDI (high-density Interconnect)
Miniature low-power systems also draw on low-power electronics design principles including advanced power cycling, and MEMS/NEMS sensor technology. Many applications also include communications (e.g., antennas, RF circuitry, analog/digital electronics), and signal processing technology.