Advanced Packaging Solutions

TIER ONE:

Component & Specialized Services

Draper’s menu-based service offerings are designed to provide discrete advanced packaging services on a rapid-turn basis, enabling customers to procure exactly the support they need without committing to a full-scale packaging engagement. These offerings are particularly attractive to universities, small businesses, government laboratories, and established defense primes who face either capacity shortages or the need for secure U.S.-based execution. Each service is delivered under the APF’s trusted manufacturing model, with the rigor of secure handling, process traceability, and compliance to defense standards.

The APF’s Tier One services include:

Die extraction and recovery, which employs precision decapsulation techniques, both chemical and plasma-based, to remove packaging material without damaging the underlying silicon. Once exposed, dies are recovered, cleaned, and prepared for re-integration. This allows customers to retrieve valuable chips from packaged devices for reuse, testing, or incorporation into next-generation systems.

Wafer reconstitution and preparation, which enables individually tested or known-good dies to be reconstructed into a new wafer for further wafer-level packaging processes. Reconstitution creates efficiencies by allowing multiple chiplets or heterogeneous dies to be co-processed and supports multi-project wafer runs that can dramatically reduce costs for early-stage innovators while ensuring secure execution for government customers.

Redistribution layer (RDL) services extend the functionality of legacy devices, enable heterogeneous chiplet integration, and form the backbone of fan-out wafer-level packaging approaches. With dual-sided RDL capabilities, Draper is positioned to support complex 3D integration schemes that are otherwise only accessible through foreign foundries.

Additional component services in Tier One include wafer thinning and backgrind services, passivation and encapsulation to protect devices in harsh environments, and assembly options such as wirebonding and small-volume prototyping. Together, these services form a modular suite that can be accessed individually or in combination, offering flexibility to customers who need rapid-turn, secure, and cost-effective packaging support.

TIER TWO:

Core & Specialized Products

Tier Two represents Draper’s flagship offerings: core productized solutions that leverage protected commercial off the shelf (COTS) technologies and specialized, program-developed products.

Underlying these offerings is Draper’s ability to design and deliver heterogeneous system-in-package (HSiPs) that combine logic, memory, RF, analog, and sensor components into a single secure package. These highly integrated solutions leverage chiplets manufactured at different process nodes and from different material systems. Interconnectivity is achieved through advanced RDLs, through-silicon vias, and interposer-less bonding approaches, while Draper also integrates anti-tamper and physically unclonable function (PUF) features into these packages to ensure mission assurance. Applications include secure AI accelerators for autonomy and ISR, radiation-hardened processors for space systems, and multi-domain command-and-control processors that meet extreme size, weight, and power efficiency requirements. 

These capabilities provide a foundation for Draper’s Core and Specialized Products. Draper’s Core productized offerings include standardized devices and modules, such as technology-protected commercial off the shelf (COTS) processors, secure field-programmable gate arrays (FPGAs), radiation-hardened microcontrollers, and trusted interface chips, that can be manufactured and sold outside of any single program of record. These core products are designed for repeatability and broad applicability, meeting common defense and aerospace needs for supply chain assurance, anti-tamper features, and trusted performance.

Draper’s Specialized Products are structured as programmatic engagements. Customers partner with Draper through the full lifecycle of their solution: from co-development of architectures and packaging designs, through fabrication and assembly, and concluding with testing, validation, and secure delivery. Each step is performed under ITAR/EAR compliance and DoD trust protocols, guaranteeing the integrity of sensitive microelectronics systems. This tier positions Draper not only as a service provider but as a strategic partner capable of delivering turnkey solutions to national security customers.

This dual-tier approach enables the APF to serve both the broad market demand for modular, rapid-turn packaging services and the high-end need for secure, custom heterogeneous integration. The Component Services tier ensures steady utilization and accessibility, while the Custom Capabilities tier provides strategic differentiation and long-term value for Draper’s national defense partners. Together, these tiers define APF as a uniquely positioned, trusted national asset in the microelectronics supply chain.